Chipbond Technology Corporation

Chipbond was established in 1997 July 2nd and was booked on the Taiwan Stock Exchange starting from 2002 January 31st. Chipbond Technology Corporation is the only company in Taiwan to supply a true full Turnkey Service for backend assembly processing of LCD driver ICs from wafer bumping to packaging. There are two fabs in operation, the LiHsin Plant and the Prosperity Plant are both located within the Hsinchu Science Park. Wafer bumping is conducted in LiHsin Plant whilst the subsequent backend processing such as testing, dicing and packaging is conducted in the Prosperity Plant. The manufacturing process for driver ICs...

金凸塊(gold bump),錫鉛凸塊(solder bump),捲帶式軟板封裝(tape carrier packaging),捲帶式薄膜覆晶(chip on film),玻璃覆晶封裝(chip on glass),覆晶(chipbga tm),and 邏輯ic(logic ic)

Chipbond technology corporation operates in the Appliances, electrical, and electronics manufacturing industry.

Chipbond technology corporation's revenue is 501m - 1b

Chipbond technology corporation has 501 - 1000 employees.